RC-860: Rapid Cycle Heat Sink Compound

Thermoforming is about heat. The primary objective is heating and cooling the plastic as fast as possible. Available in convenient 5 oz. tubes. Segen’s special thermoforming compound is a silicon-based zinc oxide that dramatically increases thermal transfer rates when applied between the mold and cooling plate. That means faster cooling molds, increased shots-per-minute and increased profits!

Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by migration and component contamination.

Spec SheetSafety Data Sheet